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According to two PowerPoint presentations posted on Twitter by @9550pro, Intel is working on an entry-level Alder Lake-S Xeon workstation processor that will be released in the third quarter of 2021. According to the picture, the Rocket Lake Xeon W-1300 chip will be phased out in favor of the Alder Lake Xeon W-1400 series, which is built on the W680 model. The Xeon W-1400 series has up to 16 cores, a 125W thermal architecture capacity (TDP), and up to 20 PCIe 4.0 channels, in addition to replacing the LGA 1700 socket.
Intel’s Alder Lake-S Xeon processor is positioned similarly to the laptop platform’s Alder Lake-S Core product line. The biggest distinction is in core workstation technologies, such as corporate and entry-level vPro (vPro) solutions.
In comparison, the Alder Lake-S Xeon W-1400 processor uses Intel’s latest W680 platform and LGA 1700 port, and the 600 series chipsets are widely available in the commercial industry (such as flagship Z690 motherboards).
The W-1400 series, which includes both large and small core designs, offers a range of configuration options:
For eg, in 2021, the version with 8 Golden Cove high-performance cores plus 8 energy-saving Gracemont cores (and 6+8 models) is expected to be manufactured in 35 weeks.
There are also SKUs that only contain the Golden Cove center (6+0), with a projected processing period of the 44th week of 2021.
In terms of thermal architecture power consumption, Alder Lake-S Xeon W-1400 series CPUs are also very “flexible,” ranging from 125W in the K series to the normal 65W and 35W in the T series SKUs.
Each CPU has 20 PCIe 4.0 channels, and the new architecture is supposed to improve single-threaded (IPC) performance by 20% over the existing Rocket Lake product line.
After discussing entry-level workstations, Intel unveiled the Ice Lake Xeon W-3300 series CPUs, which are aimed at a specific segment of the technical workstation industry.
SKU with up to 38 cores and 72 threads, 57MB cache, 4.0GHz clock frequency, 64 PCIe 4.0 channels, and 8 channels of DDR4-3200 memory with a capacity of 4TB.
It supports AVX, AVX2, AVX512, VNNI, and GNA 2.0 instruction sets and is scheduled to be launched by the end of 2021.