The “PlayStation 5 (PS5)” stationary gaming machine launched by Sony Interactive Entertainment (SIE, Sony Interactive Entertainment) on 12 November 2020 gives the traditional machine “PlayStation 4 (PS4)” a “immersive feeling” to the game.
Friday, November 13, 2020, 1:49 GMT
The goal was to lift it above that. We developed both software and hardware, such as a user interface (UI), to accomplish this. This series has so far, concentrated on the UI. From now on, Mr. Masayasu Ito (SIE Hardware Engineering & Operations EVP) who is in charge of hardware production and Mr. Yasuhiro Otori (Hardware Design Department Mecha) who is in charge of mechanical design and thermal design We will implement behind the scenes of PS5 hardware development based on an interview with the General Manager of the Department of Design.
The price would be easy for consumers to pick up” (Mr. Ito), after growing the immersive feeling, “As long as it is a PlayStation. This was the most critical thing in the production of the PS5 hardware. Thus, “we implemented both parts and technology with cost in mind, close to the previous PlayStation series,” he said.
As a result, the PS5 retail price was US$ 499 and the PS5 Downloadable Version without an optical disk drive was US$ 399, which was smaller than analysts and other gaming industries predicted. This is a “reverse zaya” price that reaches the cost, but (Mr. Ito) “attained the target cost.” In other words, PS5 seems to have a framework that makes a profit, like game software and services revenues. In the gaming industry, this type of business is popular.
PS5 was fitted with innovative features while implementing latest technologies that improve the immersive experience in the game while keeping costs as low as possible. To improve the immersive experience, there are three key hardware innovations added. It is a technology that accelerates, reduces noise and increases the sense of presence.
The immersive atmosphere of the game will decrease instantly if the UI or game doesn’t move smoothly. You will not focus on the game if the cooling fan makes a noisy noise. You can be more immersive if you can improve the sensation of presence.
However we have accelerated SSDs with a custom controller IC instead of diverting SSD goods to personal computers. The data reading speed is currently 5.5 Gbit/s, which is faster than the rival Microsoft company’s next-generation ‘Xbox Series X’. There is a difference between the speed catalog requirements (theoretical value) and the real speed (effective value) in the case of general storage goods because of the data transfer overhead. “In PS5, however, while a catalog spec is 5.5 Gbit / sec, it is “about the same as the effective value (Mr. Ito). The relation destination of the IC is set to the PS5 SoC, one of the reasons why a custom controller IC could be used.
The SSD size is 825GB. This potential is not present in personal computer SSDs that normally have 500GB or 1TB. “However it is a fair value calculated by judging that the space is appropriate” (Mr. Ito) as a result of considering the storage use status of PS4 users. Each was mounted on the main board as a separate (individual component to form an SSD instead of using a module product fitted with NAND flash memory and a controller IC like an SSD for personal computers. There are separately assembled several NAND flash memory semiconductor chips and controller ICs.
Thermal architecture has been a big challenge in hardware production owing to its high speed. “SoCs have a high running frequency, a small die, and a very high heat density (Mr. Otori), in particular. In fact, the SoC heat density during games is far greater” than that of the PS4, he said. That’s because the PS5’s SoC “basically runs during games at almost maximum power,” he said. The TDP (Thermal Design Power) value and the amount of heat produced during the game are therefore approximately the same.
Since the die size is directly related to cost and yield, the SoC die is small. That is, the smaller the scale, the lower the price, and the less likely it is that defects may reach the die, resulting in a yield increase.